Potting Resin - List of Manufacturers, Suppliers, Companies and Products

General-purpose potting resin TE-3106 low viscosity/high strength product

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

Company：寺田
Price：Other

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Thermal conductive potting resin for automotive and electronic component encapsulation EPOXIES

Flame retardant UL94, -40℃ to 135℃ heat resistance, low viscosity, no bubbles, halogen-free.

◆◆◆ We accept inquiries for evaluation samples (approximately 200g). Please consult us regarding your desired viscosity and characteristics using the contact form below. ◆◆◆ This is a potting resin that is flame-retardant, UL certified, has good thermal conductivity, is easy to pour, does not shrink, and is low outgassing and silicone-free. Price range (UL certified product): Approximately 15 yen/g It is suitable for insulating electronic components such as electric vehicle (EV) batteries, transformers, motor coils, wireless devices including Bluetooth, RFID tags, temperature sensors, etc., providing heat resistance, water resistance, shock resistance, and dustproofing. 【Product Lineup】 ■ Flame-retardant, UL certified ■ Easy to pour with low viscosity ■ Low curing shrinkage with no shrinkage issues ■ Low outgassing, silicone-free ■ Halogen-free ■ Low density and low dielectric constant (suitable for Bluetooth applications) ■ Low-temperature curing * You can download the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

Company：理経
Price：Other

Other polymer materials

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General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.

The general-purpose potting resin is endowed with high thixotropy and low elasticity. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-7017 Two-component heating curing epoxy resin Features: Acid anhydride curing, high thixotropy (T.I 4.5), low elastic modulus, crack resistance Applications: Potting for various electronic components ■ Flexural modulus: 3,800 (MPa) ■ Volume resistivity: >1 x 10¹⁶ (MΩ·m) ■ Recommended curing conditions: 120℃ x 3h + 160℃ x 1h For more details, please download the PDF below or feel free to contact us.

Company：寺田
Price：Other

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Potting Resin - List of Manufacturers, Suppliers, Companies and Products

Potting Resin Product List

General-purpose potting resin TE-3106 low viscosity/high strength product

Thermal conductive potting resin for automotive and electronic component encapsulation EPOXIES

General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.